How to Improve Bonding Strength in Microfluidic IVD Biochip Manufacturing

The following is a brief overview of the manufacturing process Megaforce used to create a new generation of microfluidic chips beginning in 2016.

Megaforce successfully micronize complex surface topographical features with geometries < 0.05mm with submicron tolerances in production. Afterwards the microchips are tested using a contact and non-contact scanner to verify dimensions and micrometer precision.

Megaforce Manufacturing Capabilities: 

Adhesive Selection: Adhesives designed specifically for the microfluidic IVD biochip manufacturing process to provide the best bonding strength and tensile strength.

Dispensing Technology & Methodologies: Extensive knowledge and experience with dispense technologies for all materials used in the microfluidic IVD biochip manufacturing process.

Bonding/Curing Parameters: The bond between two or more layers of material is important to the end-user experience. There are many requirements that need to be met to ensure that the bond is successful. These parameters can be manipulated through your choice of adhesive, temperature, pressure, time and other factors.

There are various types of bonding/curing parameters and a few examples include:

Hot melt extrusion

Pressure-sensitive adhesive dispensing

Solvent vapor dispense

Photochromic curing

UV curing